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Spectra7 Microsystems Inc. (SEV.V)

TSXV - TSXV Real Time Price. Currency in CAD
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0.7300-0.0500 (-6.41%)
As of 02:01PM EST. Market open.
Full screen
Previous Close0.7800
Open0.8700
Bid0.7300 x 0
Ask0.7400 x 0
Day's Range0.7300 - 0.7900
52 Week Range0.3100 - 1.3800
Volume21,805
Avg. Volume32,509
Market Cap29.074M
Beta (5Y Monthly)2.73
PE Ratio (TTM)N/A
EPS (TTM)-0.1900
Earnings DateApr 23, 2024 - Apr 29, 2024
Forward Dividend & YieldN/A (N/A)
Ex-Dividend DateN/A
1y Target EstN/A
  • CNW Group

    Spectra7 and ACES Announce Successful Demonstration of Industry Leading Performance for 800G Active Copper Interconnects

    (TSXV:SEV) (OTCQB:SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, and ACES Electronics Co., Ltd ("ACES"), a leading Taiwan-based connector and cable supplier, announced that they successfully demonstrated best-in-class performance of 800G Active Copper Cables (ACC's) at this year's annual DesignCon Conference Exhibition held last week in Santa Clara, California.

  • PR Newswire

    Spectra7 and Volex Announce Successful Demonstration of Industry Leading Performance for 800G Active Copper Interconnects

    (TSXV: SEV) (OTCQB: SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, and Volex plc ("Volex"), a global leader in high-speed data center interconnect products, announce that they successfully demonstrated industry leading performance of 800G Active Copper Cables (ACCs) at this year's annual DesignCon Conference Exhibition held last week in Santa Clara, California.

  • CNW Group

    Spectra7 and MultiLane to Demonstrate Robust Performance Testing of 800G Active Copper Interconnects at DesignCon 2024

    (TSXV: SEV) (OTCQB: SPVNF) Spectra7 Microsystems Inc. ("Spectra7" or the "Company"), a leading provider of high-performance analog semiconductor products for broadband connectivity markets, and MultiLane Technologies Inc. (MultiLane), a market leading manufacturer of High-Speed IO and Data Center Interconnect test solutions, announced they will demonstrate their latest 800Gbps product offerings at this year's annual DesignCon Conference Exhibition in Santa Clara, California from Jan 31-Feb 1, 20