Resonac Holdings Corporation (SWD.F)
| Previous Close | 19.60 |
| Open | 19.60 |
| Bid | 20.20 x 200000 |
| Ask | 21.00 x 200000 |
| Day's Range | 19.60 - 19.60 |
| 52 Week Range | 13.10 - 25.60 |
| Volume | |
| Avg. Volume | 18 |
| Market Cap | 3.67B |
| Beta (5Y Monthly) | 0.69 |
| PE Ratio (TTM) | N/A |
| EPS (TTM) | -0.63 |
| Earnings Date | N/A |
| Forward Dividend & Yield | 0.81 (4.08%) |
| Ex-Dividend Date | Dec 27, 2024 |
| 1y Target Est | N/A |
BloombergCEO Who Drove $7 Billion Deal Is Eyeing Japan Chip Linchpin JSR
(Bloomberg) -- Resonac Holdings Corp.’s chief executive officer is gearing up for another round of consolidation in Japan’s fragmented chip materials sector, saying the chemicals maker may raise its hand to buy a stake in linchpin JSR Corp.Most Read from BloombergBlinken’s Return From Davos Was Delayed After Plane Broke DownApple to Sell Watches Without Oxygen Feature After Legal SetbackSingapore Minister Quits After Biggest Graft Case Since 1986Dimon Says China Risk-Reward Equation Has ‘Changed
- Reuters
Japan's Resonac to open chip packaging R&D centre in US
Japanese chip materials maker Resonac said on Wednesday it will set up a research and development centre for advanced semiconductor packaging and materials in Silicon Valley. The packaging stage of production is increasingly being seen as critical for driving advances in chip technology, with the U.S. this week kicking off a $3 billion programme to boost its packaging capabilities. Resonac, formerly Showa Denko, is a leading manufacturer of materials for packaging such as films and plans to begin operations at its new centre in 2025.
