SCHMID Group N.V. (SHMDW)

SCHMID Group Takes Next Step Towards Advanced Packaging for Integrated Circuits with Glass Cores

Highlights: Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an Advanced IC Package.The main beneficiaries today are the fast-growing AI and data center sectors but soon after, we see glass cores expanding into any high-speed computing application, for example automotive applications.Based on decades of experience in glass processing and s