Rapidus Corporation, a manufacturer of advanced logic semiconductors, and multinational technology company IBM (NYSE: IBM), today announced a joint development partnership aimed at establishing mass production technologies for chiplet packages. Through this agreement, Rapidus will receive packaging technology from IBM for high-performance semiconductors, and the two companies will collaborate with a goal of further innovating in this space.
By Charlie King NORTHAMPTON, MA / ACCESSWIRE / June 3, 2024 / IBM Originally published by Charlie King on Sustainability Magazine Sustainability leaders from Coca-Cola HBC, EY and IBM discuss how corporate governance plays into their ESG and wider ...
Industry players like IBM, HPE, AGYS and PAR are gaining from the increased demand for integrated solutions and the growing adoption of the multi-cloud model, despite persistent supply chain constraints.