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E Ink Holdings Inc. (8069.TWO)

Taipei Exchange - Taipei Exchange Delayed Price. Currency in TWD
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216.50+6.00 (+2.85%)
At close: 01:30PM CST
Full screen
Previous Close210.50
Open213.00
Bid216.50 x 0
Ask217.00 x 0
Day's Range212.50 - 219.50
52 Week Range165.50 - 258.00
Volume6,792,834
Avg. Volume6,440,033
Market Cap247.769B
Beta (5Y Monthly)0.62
PE Ratio (TTM)33.72
EPS (TTM)6.42
Earnings DateAug 14, 2024 - Aug 19, 2024
Forward Dividend & Yield4.50 (2.14%)
Ex-Dividend DateJul 24, 2023
1y Target Est257.50
  • Business Wire

    E Ink Spectra 6 Wins Display of the Year During 2024 Display Week

    BILLERICA, Mass., May 09, 2024--E Ink (8069.TWO), the originator, pioneer, and global commercial leader in ePaper technology, today announced their revolutionary E Ink Spectra™ 6 full-color ePaper was recognized with a Display of the Year award by the Society for Information Display. This recognition adds E Ink to a roster of innovative companies that received the award, including Apple, Samsung, BOE, 3M, and more.

  • Business Wire

    E Ink and AUO Enter into Strategic Partnership to Develop Large-Size Color ePaper Displays

    BILLERICA, Mass., April 23, 2024--E Ink (8069.TW) the originator, pioneer, and global commercial leader in ePaper technology, today announced a strategic partnership and memorandum of understanding with AUO, a global leading supplier of display and smart application solutions, to develop large-size color ePaper displays. E Ink will provide full-color ePaper modules, while AUO will provide integrated software and hardware technologies along with the TFT backplane components.

  • Business Wire

    E Ink Teams Up with Ecosystem Partners to Develop Next-Generation ePaper Shelf Labels

    BILLERICA, Mass., April 15, 2024--E Ink (8069.TW) the originator, pioneer, and global commercial leader in ePaper technology, today announced it is collaborating with ecosystem partners Realtek Semiconductor (Realtek), Integrated Solutions Technology (IST), and Chipbond Technology Corporation (Chipbond) to develop the System on Panel (SoP) architecture. This technology will be integrated into the next-generation electronic shelf label (ESL) jointly developed with the system integrator, SOLUM. In