Previous Close | 198,600.00 |
Open | 203,500.00 |
Bid | 207,500.00 x 0 |
Ask | 208,000.00 x 0 |
Day's Range | 201,500.00 - 209,000.00 |
52 Week Range | 106,000.00 - 209,000.00 |
Volume | |
Avg. Volume | 4,092,765 |
Market Cap | 143.233T |
Beta (5Y Monthly) | 0.90 |
PE Ratio (TTM) | N/A |
EPS (TTM) | N/A |
Earnings Date | Jul 24, 2024 - Jul 29, 2024 |
Forward Dividend & Yield | 1,200.00 (0.60%) |
Ex-Dividend Date | Mar 28, 2024 |
1y Target Est | 227,903.00 |
SEOUL/SINGAPORE (Reuters) -Samsung Electronics' latest high bandwidth memory (HBM) chips have yet to pass Nvidia's tests for use in the U.S. firm's AI processors due to heat and power consumption problems, three people briefed on the issues said. The problems affect Samsung's HBM3 chips, which are the fourth-generation HBM standard currently most used in graphics processing units (GPUs) for artificial intelligence, as well as fifth-generation HBM3E chips that the South Korean tech giant and its rivals are bringing to market this year, they said. The reasons for Samsung failing Nvidia's tests are being reported for the first time.
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