|Bid||0.00 x 0|
|Ask||0.00 x 0|
|Day's Range||15.80 - 16.10|
|52 Week Range||8.15 - 16.10|
|Beta (5Y Monthly)||1.25|
|PE Ratio (TTM)||13.50|
|Forward Dividend & Yield||N/A (N/A)|
|1y Target Est||N/A|
TOKYO, May 11, 2023--Renesas released its first Sustainability Report, which details Renesas’ ESG strategies, initiatives, and results.
TOKYO, April 27, 2023--Renesas announced consolidated financial results in accordance with IFRS for the three months ended March 31, 2023.
TOKYO, April 27, 2023--Renesas announced the consolidated financial forecasts and forecasts of cash dividends for the six months ending June 30, 2023.
TOKYO, April 26, 2023--Renesas' new NB-IoT chipset for smart metering is designed to operate on the networks of all major Indian telecommunications carriers.
TOKYO, April 11, 2023--Renesas has produced its first microcontroller (MCU) based on advanced 22-nm process technology for superior performance with lower power consumption.
TOKYO, April 06, 2023--Renesas' cellular-to-cloud development kits powered by its 32-bit MCUs now fully support Microsoft’s popular Azure.
TOKYO, April 04, 2023--Renesas launched new firmware for its ZMOD air quality sensors, that supports various green air quality standards for Commercial & Public Buildings.
TOKYO, March 30, 2023--Renesas extended its industry-leading RISC-V portfolio with the first RISC-V MCU designed for voice-controlled HMI (human-machine interface) systems.
TOKYO, March 23, 2023--Renesas' new industrial MPU supports the EtherCAT communication protocol, achieving fast, accurate real-time control for industrial systems.
TOKYO, March 22, 2023--Renesas today announced its wholly owned subsidiary has entered into a definitive agreement with the shareholders of Panthronics.
TOKYO, March 14, 2023--Renesas unveiled new RA MCUs ideal for applications requiring high performance in small packages such as sensing, gaming, wearables and appliances.
TOKYO, March 09, 2023--Renesas will present the first live demonstrations of AI and machine learning (ML) implementations on an MCU based on the Arm® Cortex®-M85 processor.
BENGALURU, India & TOKYO, March 03, 2023--Renesas has tied up with Tata Consultancy Services to open an Innovation Center in India to build semiconductor designs and software solutions.
TOKYO, March 02, 2023--Renesas introduced 10 Winning Combinations with a broad range of products from its entire portfolio, including automotive and non-automotive parts.
TOKYO, March 01, 2023--Renesas introduced a cloud-based IoT system design platform that enables users to graphically build hardware and software to speed product development
TOKYO, February 28, 2023--Renesas announced the changes to its Members of the Board.
SAN FRANCISCO & TOKYO, February 23, 2023--Renesas is presenting advancements of charging technology for mobile devices at the prestigious International Solid-State Circuits Conference.
SAN FRANCISCO & TOKYO, February 22, 2023--Renesas has developed four technologies for SoC devices for in-vehicle communication gateways and presented details at ISSCC.
BARCELONA, Spain & TOKYO, February 21, 2023--Renesas plans to showcase a full RF front end solution for 5G Active Antenna Systems radios in collaboration with AMD at the Mobile World Congress.
TOKYO, February 09, 2023--Renesas resolved to authorize an acquisition of its own shares and conduct a tender offer to acquire its own shares.
TOKYO, February 09, 2023--Renesas Electronics Corporation today announced the consolidated financial forecasts for the three months ending March 31, 2023.
TOKYO, February 09, 2023--Renesas Electronics Corporation today announced consolidated financial results in accordance with IFRS for the year ended December 31, 2022.
TOKYO, February 09, 2023--Renesas announced the difference between its consolidated financial results for the year ended December 31, 2022, and in the previous period.
TOKYO, January 27, 2023--Renesas today announced that the company received a "AA" ESG rating for the first time from Morgan Stanley Capital International.
TOKYO, January 25, 2023--Renesas announced a new gate driver IC designed to drive high-voltage power devices such as IGBTs and SiC MOSFETs for EV inverters.