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ANSYS, Inc. (AKX.F)

Frankfurt - Frankfurt Delayed Price. Currency in EUR
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293.90-12.90 (-4.20%)
At close: 02:41PM CEST
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Previous Close306.80
Open298.00
Bid292.80 x 10000
Ask294.50 x 10000
Day's Range293.90 - 298.00
52 Week Range235.20 - 331.00
Volume102
Avg. Volume36
Market Cap25.657B
Beta (5Y Monthly)N/A
PE Ratio (TTM)55.04
EPS (TTM)N/A
Earnings DateN/A
Forward Dividend & YieldN/A (N/A)
Ex-Dividend DateN/A
1y Target EstN/A
  • GlobeNewswire

    Ansys Announces Q1 Financial Results

    / Q1 2024 Results Revenue of $466.6 millionGAAP diluted earnings per share of $0.40 and non-GAAP diluted earnings per share of $1.39GAAP operating profit margin of 9.3% and non-GAAP operating profit margin of 32.2%Operating cash flows of $282.8 million and unlevered operating cash flows of $292.7 millionAnnual Contract Value (ACV) of $407.4 millionDeferred revenue and backlog of $1,369.5 million on March 31, 2024 PITTSBURGH, May 01, 2024 (GLOBE NEWSWIRE) -- ANSYS, Inc. (NASDAQ: ANSS), today repo

  • PR Newswire

    TSMC Certifies Ansys Multiphysics Platforms, Enabling Next-Gen AI and HPC Chips

    Ansys (NASDAQ: ANSS) today announced the certification of its power integrity platforms for TSMC's N2 technology full production release. Both Ansys RedHawk-SC and Ansys Totem are certified for power integrity signoff on the N2 process, delivering significant speed and power advantages for high performance computing, mobile chips, and 3D-IC designs. RaptorX is now certified for TSMC's N5 technology — crucial for modeling on-chip electromagnetic integrity in radio frequency systems, 5G, telecommu

  • PR Newswire

    Ansys and TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems

    Ansys (NASDAQ: ANSS) today announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.