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By Toby Sterling
VELDHOVEN, Netherlands (Reuters) - Chip toolmaking giant ASML said on Friday it was gearing up production of its new $350 million "High NA EUV" machine, a device the size of a double decker bus central to its bid to keep its lead in a $125 billion market.
The machine, which went on display for the first time on Friday in the Dutch headquarters of Europe's largest tech company by market value, is aimed at Intel and other makers of the highest-end semiconductors.
ASML said it was expecting to ship "a number" of them this year, and there was still work to do on customising and installation.
"We keep engineering and developing and there's a lot of work to be done to calibrate it and make sure it fits into the manufacturing system," ASML spokesperson Monique Mols said. "There's also a steep learning curve for us and our customers."
ASML is the only maker of a key technology - extreme ultraviolet (EUV) photolithography - needed to manufacture the most advanced chips.
High NA EUV is the next generation of that technology. But analysts said it was an open question how many customers are ready to switch over to the high-cost devices.
"While some chipmakers may introduce it earlier in an attempt to gain technology leadership, the majority will not adopt it until it makes sense economically," Jeff Koch of Semianalysis, said.
Customers could choose to wait and squeeze more out of existing tools. Koch's own calculations suggested it would only become cost effective to switch over from the older technology around 2030-2031.
"This means ASML is likely to have excess High-NA capacity between their factory ramp in 2027-28 and full adoption in leading-edge logic a few years later," he added.
ASML CEO Peter Wennink told Reuters in January analysts may be underestimating the technology.
"Everything that we're currently seeing in the discussion with our customers is that High NA is cheaper," he said in an interview.
Greet Storms, head of ASML's High NA product management, said on Friday an inflection point is coming around 2026-2027.
"This is the point clients will take it into volume production," she told reporters.
Intel has already taken delivery of one pilot device, and said it plans to start production next year, without giving details on the scale of the operation.
TSMC and Samsung have said they intend to use the tool but have not specified when.
ASML says it has taken between 10 and 20 orders to date - including pilot devices for memory specialists SK Hynix and Micron - and is building capacity to be able to deliver 20 annually by 2028.