Research and Markets: Advances in Abrasive Technology XV Contains The 15th International Symposium On Advances In Abrasive Technology, September 25-28, 2012, Singapore

DUBLIN--(BUSINESS WIRE)--

Research and Markets (http://www.researchandmarkets.com/research/48fr3s/advances_in) has announced the addition of the "Advances in Abrasive Technology XV" report to their offering.

Series: Advanced Materials Research, Volume 565

Selected, peer reviewed papers from the 15th International Symposium on Advances in Abrasive Technology (ISAAT2012), September 25-28, 2012, Singapore

This book brings together the latest developments in, and applications of, abrasive technology. The topics covered include: grinding and grinding wheels, truing and dressing techniques for grinding wheels, finishing, lapping, honing and polishing, abrasive-jet machining, advances in machining technologies, micro/nano-fabrication, as well as other novel technologies and advanced studies relevant to abrasive technology and precision manufacturing. This work will represent an invaluable reference source for professionals in the precision manufacturing field who wish to keep abreast of state-of-the-art developments in abrasive technology and who are interested in understanding further the fundamentals of this discipline.

Some of the Table of Contents (109 papers, 10 per page listed):

Ultrafine Surface Finishing of Fused Silica Glass Using MCF (Magnetic Compound Fluid) Wheel

Yong Bo Wu, L. Jiao, Hui Ru Guo, M. Fujimoto, K. Shimada p3

Study on the High-Efficiency Smoothness Grinding of Soft Magnetic Powder Cores

Tomoyuki Ueno, Tomoyuki Ishimine, Kenji Matsunuma, Takao Nishioka, Yasushi Mochida, Yoshiyuki Shimada p10

Grinding Performance Using Alkaline Electrolyzed and High-Frequency Reduced Water

Shinichi Iba, Kazuhito Ohashi, Kazuyuki Honiden, Iwao Kitajima, Shinya Tsukamoto p16

Study on Grinding Processing of Sapphire Wafer

Yutaro Ebina, Wei Hang, Li Bo Zhou, Jun Shimizu, Onuki Teppei, Hirotaka Ojima, Yoshiaki Tashiro p22

Effect of the Grain Depth of Cut on Cross Sectional Profile - Theoretical Analysis of Ground Surface Roughness

Nobuhito Yoshihara, Hiroaki Murakami, Naohiro Nishikawa, Masahiro Mizuno, Toshirou Iyama p28

Development of a Vitrified Bonded Superabrasive Wheel with Electrical Conductivity and its Application

Manabu Iwai, Yuya Kazui, Shinichi Ninomiya, Kiyoshi Suzuki p34

Fundamental Study on Setting of Diamond Abrasive Grains Using Electrostatic Force for Single-Layered Metal Bond Wheel

Kazuhito Ohashi, Yusaku Kawasuji, Yoshifumi Shinji, Yoshitaka Samejima, Soma Ogawa, Shinya Tsukamoto p40

Porous Composite-Bonded CBN Grinding Wheel with Alumina Bubbles

Z.Z. Chen, Wen Feng Ding, Jiu Hua Xu, C.J. Song, Y.C. Fu, C.Y. Yang p46

For more information visit http://www.researchandmarkets.com/research/48fr3s/advances_in